Recent Advances in Limiting Fatigue Damage Accumulation Induced by Self-Heating in Polymer-Matrix Composites

Polymers (Basel). 2022 Dec 9;14(24):5384. doi: 10.3390/polym14245384.

Abstract

The self-heating effect can be considered as a catastrophic phenomenon that occurs in polymers and polymer-matrix composites (PMCs) subjected to fatigue loading or vibrations. This phenomenon appears in the form of temperature growth in such structures due to their relatively low thermal conductivities. The appearance of thermal stress resulting from temperature growth and the coefficient of thermal expansion (CTE) mismatch between fibers and neighboring polymer matrix initiates and/or accelerates structural degradation and consequently provokes sudden fatigue failure in the structures. Therefore, it is of primary significance for a number of practical applications to first characterize the degradation mechanism at the nano-, micro- and macroscales caused by the self-heating phenomenon and then minimize it through the implementation of numerous approaches. One viable solution is to cool the surfaces of considered structures using various cooling scenarios, such as environmental and operational factors, linked with convection, contributing to enhancing heat removal through convection. Furthermore, if materials are appropriately selected regarding their thermomechanical properties involving thermal conductivity, structural degradation may be prevented or at least minimized. This article presents a benchmarking survey of the conducted research studies associated with the fatigue performance of cyclically loaded PMC structures and an analysis of possible solutions to avoid structural degradation caused by the self-heating effect.

Keywords: cooling techniques; materials design; polymer–matrix composites (PMCs); scale-based fatigue damage mechanism; self-heating effect; structural degradation of PMCs; thermal conductivity; viscoelasticity.

Publication types

  • Review

Grants and funding

This research received no external funding.