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hsieh chih cheng
(67 results)?
Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications.
Micromachines (Basel). 2023 Jun 30;14(7):1356. doi: 10.3390/mi14071356.
Micromachines (Basel). 2023.
PMID: 37512669
Free PMC article.
Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization.
Cheng HC, Ma CL, Liu YL.
Cheng HC, et al.
Micromachines (Basel). 2023 Jun 28;14(7):1325. doi: 10.3390/mi14071325.
Micromachines (Basel). 2023.
PMID: 37512636
Free PMC article.
Item in Clipboard
Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles.
Cheng HC, Lin SY, Liu YC.
Cheng HC, et al.
Materials (Basel). 2021 Sep 19;14(18):5427. doi: 10.3390/ma14185427.
Materials (Basel). 2021.
PMID: 34576651
Free PMC article.
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Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication.
Cheng HC, Tai LC, Liu YC.
Cheng HC, et al.
Materials (Basel). 2021 Aug 25;14(17):4816. doi: 10.3390/ma14174816.
Materials (Basel). 2021.
PMID: 34500909
Free PMC article.
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Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging.
Cheng HC, Jhu WY.
Cheng HC, et al.
Materials (Basel). 2023 Dec 3;16(23):7491. doi: 10.3390/ma16237491.
Materials (Basel). 2023.
PMID: 38068235
Free PMC article.
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Structural Optimizations of Silicon Based NMOSFETs with a Sunken STI Pattern by Using a Robust Stress Simulation Methodology.
Lee CC, Liu CH, Cheng HC, Deng RH.
Lee CC, et al. Among authors: cheng hc.
J Nanosci Nanotechnol. 2015 Mar;15(3):2179-84. doi: 10.1166/jnn.2015.10226.
J Nanosci Nanotechnol. 2015.
PMID: 26413637
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