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Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2016 | 1 |
2019 | 2 |
2021 | 1 |
2023 | 3 |
2024 | 0 |
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7 results
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Page 1
Conflict of Interest Disclosures.
Global Spine J. 2023 May;13(2_suppl):568S-591S. doi: 10.1177/21925682231173597.
Global Spine J. 2023.
PMID: 37222100
Free PMC article.
No abstract available.
TFOS Lifestyle: Impact of contact lenses on the ocular surface.
Jones L, Efron N, Bandamwar K, Barnett M, Jacobs DS, Jalbert I, Pult H, Rhee MK, Sheardown H, Shovlin JP, Stahl U, Stanila A, Tan J, Tavazzi S, Ucakhan OO, Willcox MDP, Downie LE.
Jones L, et al.
Ocul Surf. 2023 Jul;29:175-219. doi: 10.1016/j.jtos.2023.04.010. Epub 2023 May 4.
Ocul Surf. 2023.
PMID: 37149139
Item in Clipboard
A FinnGen pilot clinical recall study for Alzheimer's disease.
Julkunen V, Schwarz C, Kalapudas J, Hallikainen M, Piironen AK, Mannermaa A, Kujala H, Laitinen T, Kosma VM, Paajanen TI, Kälviäinen R, Hiltunen M, Herukka SK, Kärkkäinen S, Kokkola T, Urjansson M; FinnGen; Perola M, Palotie A, Vuoksimaa E, Runz H.
Julkunen V, et al.
Sci Rep. 2023 Aug 3;13(1):12641. doi: 10.1038/s41598-023-39835-7.
Sci Rep. 2023.
PMID: 37537264
Free PMC article.
Item in Clipboard
Three-dimensional platinum nanoparticle-based bridges for ammonia gas sensing.
Isaac NA, Reiprich J, Schlag L, Moreira PHO, Baloochi M, Raheja VA, Hess AL, Centeno LF, Ecke G, Pezoldt J, Jacobs HO.
Isaac NA, et al.
Sci Rep. 2021 Jun 15;11(1):12551. doi: 10.1038/s41598-021-91975-w.
Sci Rep. 2021.
PMID: 34131217
Free PMC article.
Item in Clipboard
Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.
Biswas S, Mozafari M, Stauden T, Jacobs HO.
Biswas S, et al.
Micromachines (Basel). 2016 Mar 28;7(4):54. doi: 10.3390/mi7040054.
Micromachines (Basel). 2016.
PMID: 30407427
Free PMC article.
Review.
Item in Clipboard
Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.
Biswas S, Schoeberl A, Hao Y, Reiprich J, Stauden T, Pezoldt J, Jacobs HO.
Biswas S, et al.
Nat Commun. 2019 Oct 28;10(1):4909. doi: 10.1038/s41467-019-12870-7.
Nat Commun. 2019.
PMID: 31659160
Free PMC article.
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Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points.
Kaltwasser M, Schmidt U, Lösing L, Biswas S, Stauden T, Bund A, Jacobs HO.
Kaltwasser M, et al.
Sci Rep. 2019 Aug 5;9(1):11325. doi: 10.1038/s41598-019-47690-8.
Sci Rep. 2019.
PMID: 31383873
Free PMC article.
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