Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Hongpeng Jiang; Guangqiang Yan; Jianwei Li; Jie Xu; Debin Shan; Bin Guo

doi:10.3390/ma14174869

Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Materials (Basel). 2021 Aug 27;14(17):4869. doi: 10.3390/ma14174869.

Authors

Hongpeng Jiang^{1

2}, Guangqiang Yan^{1

2}, Jianwei Li^{1

2}, Jie Xu^{1

2}, Debin Shan^{1

2}, Bin Guo^{1

2}

Affiliations

¹ State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
² School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China.

Abstract

Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.

Keywords: T-shape upsetting test; equal-channel angular pressing; micro-forming; pure copper; ultrafine grains.

Abstract

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