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Page 1
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.
Micromachines (Basel). 2022 Jul 5;13(7):1072. doi: 10.3390/mi13071072.
Micromachines (Basel). 2022.
PMID: 35888889
Free PMC article.
Broadband responsivity enhancement of Si photodiodes by a plasmonic antireflection bilayer.
Park J, Kang IS, Sim G, Kim TH, Lee JK.
Park J, et al. Among authors: sim g.
Opt Express. 2021 Aug 16;29(17):26634-26644. doi: 10.1364/OE.432689.
Opt Express. 2021.
PMID: 34615094
Free article.
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