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fang cheng duan
(8 results)?
CoSn3 Intermetallic Nanoparticles for Electronic Packaging.
Nanomaterials (Basel). 2022 Nov 20;12(22):4083. doi: 10.3390/nano12224083.
Nanomaterials (Basel). 2022.
PMID: 36432370
Free PMC article.
A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging.
Wang J, Wang X, Zhang L, Zhang L, Duan F, Wang F, Zhang W, Wang J, Zhang Z, Hang C, Chen H.
Wang J, et al. Among authors: duan f.
Materials (Basel). 2022 Jan 25;15(3):914. doi: 10.3390/ma15030914.
Materials (Basel). 2022.
PMID: 35160861
Free PMC article.
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Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core-shell particles.
Wang J, Wang J, Duan F, Chen H.
Wang J, et al. Among authors: duan f.
Sci Rep. 2023 Jan 12;13(1):668. doi: 10.1038/s41598-023-27870-3.
Sci Rep. 2023.
PMID: 36635376
Free PMC article.
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