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Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
Materials (Basel). 2021 May 2;14(9):2367. doi: 10.3390/ma14092367.
Materials (Basel). 2021.
PMID: 34063188
Free PMC article.
Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores.
Sa YK, Bang J, Son J, Yu DY, Kim YC.
Sa YK, et al. Among authors: yu dy.
Materials (Basel). 2021 Apr 28;14(9):2284. doi: 10.3390/ma14092284.
Materials (Basel). 2021.
PMID: 33925006
Free PMC article.
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Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
Jeong G, Yu DY, Baek S, Bang J, Lee TI, Jung SB, Kim J, Ko YH.
Jeong G, et al. Among authors: yu dy.
Materials (Basel). 2021 Jan 11;14(2):335. doi: 10.3390/ma14020335.
Materials (Basel). 2021.
PMID: 33440741
Free PMC article.
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