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do sook kim
(35 results)?
The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
Materials (Basel). 2019 Mar 22;12(6):960. doi: 10.3390/ma12060960.
Materials (Basel). 2019.
PMID: 30909434
Free PMC article.
Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.
Kang MS, Kim DS, Shin YE.
Kang MS, et al. Among authors: kim ds.
Materials (Basel). 2019 Mar 21;12(6):936. doi: 10.3390/ma12060936.
Materials (Basel). 2019.
PMID: 30901825
Free PMC article.
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