Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Dibakor Boruah; Nele Dewagtere; Bilal Ahmad; Rafael Nunes; Jeroen Tacq; Xiang Zhang; Hua Guo; Wim Verlinde; Wim De Waele

doi:10.3390/ma16041702

Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Materials (Basel). 2023 Feb 17;16(4):1702. doi: 10.3390/ma16041702.

Authors

Dibakor Boruah¹, Nele Dewagtere¹, Bilal Ahmad², Rafael Nunes³, Jeroen Tacq⁴, Xiang Zhang², Hua Guo², Wim Verlinde³, Wim De Waele¹

Affiliations

¹ Department of Electromechanical, Systems and Metal Engineering, Faculty of Engineering and Architecture, Ghent University, 9052 Ghent, Belgium.
² Faculty of Engineering, Environment and Computing, Coventry University, Coventry CV1 5FB, UK.
³ Belgian Welding Institute, 9052 Ghent, Belgium.
⁴ Sirris, 9052 Ghent, Belgium.

Abstract

This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.

Keywords: X-ray diffraction; additive manufacturing; contour method; digital image correlation; residual stresses; wire + arc additive manufacturing.

Grants and funding

There was no official funding for this work. This work originated from an internal exploratory project and voluntary contributions of collaborating institutes and authors.