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Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.
Polymers (Basel). 2023 May 30;15(11):2526. doi: 10.3390/polym15112526.
Polymers (Basel). 2023.
PMID: 37299324
Free PMC article.
FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.
Kalaš D, Šíma K, Kadlec P, Polanský R, Soukup R, Řeboun J, Hamáček A.
Kalaš D, et al.
Polymers (Basel). 2021 Oct 27;13(21):3702. doi: 10.3390/polym13213702.
Polymers (Basel). 2021.
PMID: 34771261
Free PMC article.
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