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chen li kai
(14 results)?
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration.
Materials (Basel). 2022 Nov 4;15(21):7783. doi: 10.3390/ma15217783.
Materials (Basel). 2022.
PMID: 36363374
Free PMC article.
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.
Huang JH, Shih PS, Renganathan V, Gräfner SJ, Lin YC, Kao CL, Lin YS, Hung YC, Kao CR.
Huang JH, et al. Among authors: kao cl.
Materials (Basel). 2024 Apr 3;17(7):1638. doi: 10.3390/ma17071638.
Materials (Basel). 2024.
PMID: 38612152
Free PMC article.
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