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Page 1
Development of LED Package Heat Dissipation Research.
Micromachines (Basel). 2022 Jan 30;13(2):229. doi: 10.3390/mi13020229.
Micromachines (Basel). 2022.
PMID: 35208353
Free PMC article.
Review.
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling.
Tan L, Liu P, She C, Xu P, Yan L, Quan H.
Tan L, et al. Among authors: she c.
Micromachines (Basel). 2022 Mar 31;13(4):554. doi: 10.3390/mi13040554.
Micromachines (Basel). 2022.
PMID: 35457859
Free PMC article.
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Research on Heat Dissipation of Multi-Chip LED Filament Package.
Tan L, Liu P, She C, Xu P, Yan L, Quan H.
Tan L, et al. Among authors: she c.
Micromachines (Basel). 2021 Dec 31;13(1):77. doi: 10.3390/mi13010077.
Micromachines (Basel). 2021.
PMID: 35056241
Free PMC article.
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