Search Page
Save citations to file
Email citations
Send citations to clipboard
Add to Collections
Add to My Bibliography
Create a file for external citation management software
Your saved search
Your RSS Feed
Filters
Results by year
Table representation of search results timeline featuring number of search results per year.
Year | Number of Results |
---|---|
2022 | 1 |
2023 | 1 |
2024 | 1 |
Search Results
3 results
Results by year
Filters applied: . Clear all
It looks like you are searching for an author.
Results are currently sorted by Best Match. To see the newest results first,
change the sort order to Most Recent.
Page 1
Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices.
Materials (Basel). 2022 Feb 14;15(4):1397. doi: 10.3390/ma15041397.
Materials (Basel). 2022.
PMID: 35207937
Free PMC article.
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications.
Huang JH, Shih PS, Renganathan V, Gräfner SJ, Lin YC, Kao CL, Lin YS, Hung YC, Kao CR.
Huang JH, et al. Among authors: kao cr.
Materials (Basel). 2024 Apr 3;17(7):1638. doi: 10.3390/ma17071638.
Materials (Basel). 2024.
PMID: 38612152
Free PMC article.
Item in Clipboard
Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study.
Gräfner SJ, Huang JH, Wu PY, Renganathan V, Shih PS, Kao CR.
Gräfner SJ, et al. Among authors: kao cr.
Adv Mater. 2023 Nov 8:e2307850. doi: 10.1002/adma.202307850. Online ahead of print.
Adv Mater. 2023.
PMID: 37941505
Item in Clipboard
Cite
Cite