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Year | Number of Results |
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2013 | 1 |
2016 | 1 |
2019 | 1 |
2020 | 1 |
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2023 | 1 |
2024 | 0 |
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Page 1
Large-Scale Defect Clusters with Hexagonal Honeycomb-like Arrangement in Ammonothermal GaN Crystals.
Materials (Basel). 2022 Oct 9;15(19):6996. doi: 10.3390/ma15196996.
Materials (Basel). 2022.
PMID: 36234338
Free PMC article.
X-ray diffraction imaging of fully packaged n-p-n transistors under accelerated ageing conditions.
Tanner BK, Danilewsky A, McNally PJ.
Tanner BK, et al. Among authors: danilewsky a.
J Appl Crystallogr. 2022 Aug 30;55(Pt 5):1139-1146. doi: 10.1107/S1600576722007142. eCollection 2022 Oct 1.
J Appl Crystallogr. 2022.
PMID: 36249506
Free PMC article.
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Dislocation arrangements in 4H-SiC and their influence on the local crystal lattice properties.
Roder M, Steiner J, Wellmann P, Kabukcuoglu M, Hamann E, Haaga S, Hänschke D, Danilewsky A.
Roder M, et al. Among authors: danilewsky a.
J Appl Crystallogr. 2023 May 29;56(Pt 3):776-786. doi: 10.1107/S1600576723003291. eCollection 2023 Jun 1.
J Appl Crystallogr. 2023.
PMID: 37284267
Free PMC article.
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Dynamical X-ray diffraction imaging of voids in dislocation-free high-purity germanium single crystals.
Gradwohl KP, Danilewsky AN, Roder M, Schmidbauer M, Janicskó-Csáthy J, Gybin A, Abrosimov N, Sumathi RR.
Gradwohl KP, et al. Among authors: danilewsky an.
J Appl Crystallogr. 2020 Jun 12;53(Pt 4):880-884. doi: 10.1107/S1600576720005993. eCollection 2020 Aug 1.
J Appl Crystallogr. 2020.
PMID: 32788899
Free PMC article.
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Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage.
Rack A, Scheel M, Danilewsky AN.
Rack A, et al. Among authors: danilewsky an.
IUCrJ. 2016 Jan 5;3(Pt 2):108-14. doi: 10.1107/S205225251502271X. eCollection 2016 Mar 1.
IUCrJ. 2016.
PMID: 27006774
Free PMC article.
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Analysis of the Basal Plane Dislocation Density and Thermomechanical Stress during 100 mm PVT Growth of 4H-SiC.
Steiner J, Roder M, Nguyen BD, Sandfeld S, Danilewsky A, Wellmann PJ.
Steiner J, et al. Among authors: danilewsky a.
Materials (Basel). 2019 Jul 9;12(13):2207. doi: 10.3390/ma12132207.
Materials (Basel). 2019.
PMID: 31323918
Free PMC article.
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Crack propagation and fracture in silicon wafers under thermal stress.
Danilewsky A, Wittge J, Kiefl K, Allen D, McNally P, Garagorri J, Elizalde MR, Baumbach T, Tanner BK.
Danilewsky A, et al.
J Appl Crystallogr. 2013 Aug 1;46(Pt 4):849-855. doi: 10.1107/S0021889813003695. Epub 2013 Jun 7.
J Appl Crystallogr. 2013.
PMID: 24046487
Free PMC article.
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