The damage mechanism in copper studied using in situ TEM nanoindentation.
Wang D, Zhang Z, Liu D, Deng X, Shi C, Gu Y, Liu X, Liu X, Wen W.
Wang D, et al. Among authors: liu x, liu d.
Nanoscale Adv. 2024 Jan 3;6(8):2002-2012. doi: 10.1039/d3na00960b. eCollection 2024 Apr 16.
Nanoscale Adv. 2024.
PMID: 38633054
Free PMC article.