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Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
Micromachines (Basel). 2023 Jun 24;14(7):1297. doi: 10.3390/mi14071297.
Micromachines (Basel). 2023.
PMID: 37512608
Free PMC article.
Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device.
Mouskeftaras A, Beurthey S, Cogan J, Hallewell G, Leroy O, Grojo D, Perrin-Terrin M.
Mouskeftaras A, et al. Among authors: beurthey s.
Micromachines (Basel). 2021 Aug 30;12(9):1054. doi: 10.3390/mi12091054.
Micromachines (Basel). 2021.
PMID: 34577698
Free PMC article.
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