Wrap-like transfer printing for three-dimensional curvy electronics.
Chen X, Jian W, Wang Z, Ai J, Kang Y, Sun P, Wang Z, Ma Y, Wang H, Chen Y, Feng X.
Chen X, et al. Among authors: jian w.
Sci Adv. 2023 Jul 28;9(30):eadi0357. doi: 10.1126/sciadv.adi0357. Epub 2023 Jul 26.
Sci Adv. 2023.
PMID: 37494444
Free PMC article.