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Cui K, Du L, Du W, Cui L, Zhang Y, Chen W, Low CTJ, Zai J.Cui K, et al. Among authors: du l, du w.J Colloid Interface Sci. 2023 Aug;643:292-304. doi: 10.1016/j.jcis.2023.04.037. Epub 2023 Apr 13.J Colloid Interface Sci. 2023.PMID: 37075538
Gong Q, Li G, Qian X, Cao H, Du W, Ma X.Gong Q, et al. Among authors: du w.J Colloid Interface Sci. 2006 Dec 15;304(2):408-12. doi: 10.1016/j.jcis.2006.09.050. Epub 2006 Sep 26.J Colloid Interface Sci. 2006.PMID: 17046782
Wei C, Cheng C, Ma L, Liu M, Kong D, Du W, Pang H.Wei C, et al. Among authors: du w.Dalton Trans. 2016 Jun 28;45(26):10789-97. doi: 10.1039/c6dt01025c.Dalton Trans. 2016.PMID: 27295406
Pang H, Wang S, Shao W, Zhao S, Yan B, Li X, Li S, Chen J, Du W.Pang H, et al. Among authors: du w.Nanoscale. 2013 Jul 7;5(13):5752-7. doi: 10.1039/c3nr01460f. Epub 2013 Jun 5.Nanoscale. 2013.PMID: 23736798
Cheng C, Kong D, Wei C, Du W, Zhao J, Feng Y, Duan Q.Cheng C, et al. Among authors: du w.Dalton Trans. 2017 Apr 19;46(16):5406-5413. doi: 10.1039/c7dt00355b.Dalton Trans. 2017.PMID: 28387399
Wei C, Cheng C, Zhao J, Wang Y, Cheng Y, Xu Y, Du W, Pang H.Wei C, et al. Among authors: du w.Chem Asian J. 2015 Mar;10(3):679-86. doi: 10.1002/asia.201403198. Epub 2015 Feb 3.Chem Asian J. 2015.PMID: 25648528
Wei C, Cheng C, Cheng Y, Wang Y, Xu Y, Du W, Pang H.Wei C, et al. Among authors: du w.Dalton Trans. 2015 Oct 21;44(39):17278-85. doi: 10.1039/c5dt02724a. Epub 2015 Sep 17.Dalton Trans. 2015.PMID: 26379066
Pang H, Ma Y, Li G, Chen J, Zhang J, Zheng H, Du W.Pang H, et al. Among authors: du w.Dalton Trans. 2012 Nov 21;41(43):13284-91. doi: 10.1039/c2dt31916k.Dalton Trans. 2012.PMID: 23023820
Wei C, Cheng C, Zhao J, Wang Z, Wu H, Gu K, Du W, Pang H.Wei C, et al. Among authors: du w.ChemistryOpen. 2015 Feb;4(1):32-8. doi: 10.1002/open.201402044. Epub 2014 Nov 11.ChemistryOpen. 2015.PMID: 25861568Free PMC article.
Sun K, Wang X, Zhang C, Zhang S, Chen Y, Jiao H, Du W.Sun K, et al. Among authors: du w.Chem Asian J. 2017 Mar 16;12(6):713-717. doi: 10.1002/asia.201700017. Epub 2017 Feb 22.Chem Asian J. 2017.PMID: 28169494