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Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.
Polymers (Basel). 2023 May 30;15(11):2526. doi: 10.3390/polym15112526.
Polymers (Basel). 2023.
PMID: 37299324
Free PMC article.
Study of Internal Stress in Conductive and Dielectric Thick Films.
Hlina J, Reboun J, Janda M, Hamacek A.
Hlina J, et al. Among authors: reboun j.
Materials (Basel). 2022 Dec 6;15(23):8686. doi: 10.3390/ma15238686.
Materials (Basel). 2022.
PMID: 36500182
Free PMC article.
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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.
Hlina J, Reboun J, Simonovsky M, Syrovy T, Janda M, Hamacek A.
Hlina J, et al. Among authors: reboun j.
Materials (Basel). 2022 Feb 12;15(4):1372. doi: 10.3390/ma15041372.
Materials (Basel). 2022.
PMID: 35207913
Free PMC article.
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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.
Hlina J, Reboun J, Hamacek A.
Hlina J, et al. Among authors: reboun j.
Materials (Basel). 2021 Nov 20;14(22):7039. doi: 10.3390/ma14227039.
Materials (Basel). 2021.
PMID: 34832439
Free PMC article.
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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.
Kalaš D, Šíma K, Kadlec P, Polanský R, Soukup R, Řeboun J, Hamáček A.
Kalaš D, et al. Among authors: reboun j.
Polymers (Basel). 2021 Oct 27;13(21):3702. doi: 10.3390/polym13213702.
Polymers (Basel). 2021.
PMID: 34771261
Free PMC article.
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