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Measurement of re-entry plasma density using microwave reflectometer in laboratory.
Rev Sci Instrum. 2022 Oct 1;93(10):103521. doi: 10.1063/5.0093263.
Rev Sci Instrum. 2022.
PMID: 36319369
Silicon Oxide Etching Process of NF3 and F3NO Plasmas with a Residual Gas Analyzer.
Kim WJ, Bang IY, Kim JH, Park YS, Kwon HT, Shin GW, Kang MH, Cho Y, Kwon BH, Kwak JH, Kwon GC.
Kim WJ, et al. Among authors: bang iy.
Materials (Basel). 2021 Jun 2;14(11):3026. doi: 10.3390/ma14113026.
Materials (Basel). 2021.
PMID: 34199585
Free PMC article.
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Necking Reduction at Low Temperature in Aspect Ratio Etching of SiO2 at CF4/H2/Ar Plasma.
Kwon HT, Bang IY, Kim JH, Kim HJ, Lim SY, Kim SY, Cho SH, Kim JH, Kim WJ, Shin GW, Kwon GC.
Kwon HT, et al. Among authors: bang iy.
Nanomaterials (Basel). 2024 Jan 17;14(2):209. doi: 10.3390/nano14020209.
Nanomaterials (Basel). 2024.
PMID: 38251172
Free PMC article.
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