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Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints.
Materials (Basel). 2021 Dec 20;14(24):7909. doi: 10.3390/ma14247909.
Materials (Basel). 2021.
PMID: 34947502
Free PMC article.
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.
Illés B, Hurtony T, Krammer O, Medgyes B, Dušek K, Bušek D.
Illés B, et al. Among authors: krammer o.
Materials (Basel). 2019 Nov 3;12(21):3609. doi: 10.3390/ma12213609.
Materials (Basel). 2019.
PMID: 31684157
Free PMC article.
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Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.
Hurtony T, Krammer O, Illés B, Harsányi G, Bušek D, Dušek K.
Hurtony T, et al. Among authors: krammer o.
Materials (Basel). 2020 Nov 20;13(22):5251. doi: 10.3390/ma13225251.
Materials (Basel). 2020.
PMID: 33233687
Free PMC article.
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Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys.
Skwarek A, Krammer O, Hurtony T, Ptak P, Górecki K, Wroński S, Straubinger D, Witek K, Illés B.
Skwarek A, et al. Among authors: krammer o.
Nanomaterials (Basel). 2021 Jun 11;11(6):1545. doi: 10.3390/nano11061545.
Nanomaterials (Basel). 2021.
PMID: 34208099
Free PMC article.
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Investigating Machine Learning Techniques for Predicting the Process Characteristics of Stencil Printing.
Martinek P, Illés B, Codreanu N, Krammer O.
Martinek P, et al. Among authors: krammer o.
Materials (Basel). 2022 Jul 6;15(14):4734. doi: 10.3390/ma15144734.
Materials (Basel). 2022.
PMID: 35888201
Free PMC article.
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Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors.
Tafferner Z, Balázs I, Krammer O, Géczy A.
Tafferner Z, et al. Among authors: krammer o.
Sensors (Basel). 2023 May 18;23(10):4879. doi: 10.3390/s23104879.
Sensors (Basel). 2023.
PMID: 37430793
Free PMC article.
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