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Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb.
Materials (Basel). 2020 Feb 21;13(4):968. doi: 10.3390/ma13040968.
Materials (Basel). 2020.
PMID: 32098085
Free PMC article.
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.
Illés B, Hurtony T, Krammer O, Medgyes B, Dušek K, Bušek D.
Illés B, et al. Among authors: hurtony t.
Materials (Basel). 2019 Nov 3;12(21):3609. doi: 10.3390/ma12213609.
Materials (Basel). 2019.
PMID: 31684157
Free PMC article.
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Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies.
Skwarek A, Ptak P, Górecki K, Hurtony T, Illés B.
Skwarek A, et al. Among authors: hurtony t.
Materials (Basel). 2020 Mar 28;13(7):1563. doi: 10.3390/ma13071563.
Materials (Basel). 2020.
PMID: 32231058
Free PMC article.
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Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.
Hurtony T, Krammer O, Illés B, Harsányi G, Bušek D, Dušek K.
Hurtony T, et al.
Materials (Basel). 2020 Nov 20;13(22):5251. doi: 10.3390/ma13225251.
Materials (Basel). 2020.
PMID: 33233687
Free PMC article.
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Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys.
Skwarek A, Krammer O, Hurtony T, Ptak P, Górecki K, Wroński S, Straubinger D, Witek K, Illés B.
Skwarek A, et al. Among authors: hurtony t.
Nanomaterials (Basel). 2021 Jun 11;11(6):1545. doi: 10.3390/nano11061545.
Nanomaterials (Basel). 2021.
PMID: 34208099
Free PMC article.
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