Interfacial Thermal Conductance between Cu and Diamond with Interconnected W-W2C Interlayer.
Zhang Y, Wang Z, Li N, Che Z, Liu X, Chang G, Hao J, Dai J, Wang X, Sun F, Zhang H.
Zhang Y, et al. Among authors: wang x, wang z.
ACS Appl Mater Interfaces. 2022 Aug 3;14(30):35215-35228. doi: 10.1021/acsami.2c07190. Epub 2022 Jul 25.
ACS Appl Mater Interfaces. 2022.
PMID: 35878880