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Islam MS, Yeum JH, Das AK.Islam MS, et al. Among authors: das ak.J Colloid Interface Sci. 2012 Feb 15;368(1):400-5. doi: 10.1016/j.jcis.2011.11.002. Epub 2011 Nov 10.J Colloid Interface Sci. 2012.PMID: 22137854
Islam MS, Yeum JH, Das AK.Islam MS, et al. Among authors: das ak.J Colloid Interface Sci. 2012 Feb 15;368(1):273-81. doi: 10.1016/j.jcis.2011.11.007. Epub 2011 Nov 19.J Colloid Interface Sci. 2012.PMID: 22172694
Karim MM, Das AK, Lee SH.Karim MM, et al. Among authors: das ak.Anal Chim Acta. 2006 Aug 18;576(1):37-42. doi: 10.1016/j.aca.2006.01.079. Epub 2006 Mar 3.Anal Chim Acta. 2006.PMID: 17723611
Biswas S, Karim S, Bhunia P, Banerjee S, Das AK, Das D.Biswas S, et al. Among authors: das ak.Dalton Trans. 2024 May 30. doi: 10.1039/d4dt00357h. Online ahead of print.Dalton Trans. 2024.PMID: 38812408
Saha S, De A, Banerjee S, Das AK, Ohlin CA, Mondal R.Saha S, et al. Among authors: das ak.Inorg Chem. 2024 May 28. doi: 10.1021/acs.inorgchem.4c01078. Online ahead of print.Inorg Chem. 2024.PMID: 38805642
Ahsan SM, Injamum-Ul-Hoque M, Das AK, Rahman MM, Mollah MMI, Paul NC, Choi HW.Ahsan SM, et al. Among authors: das ak.Plants (Basel). 2024 May 20;13(10):1420. doi: 10.3390/plants13101420.Plants (Basel). 2024.PMID: 38794490Free PMC article.Review.
Aminiranjbar Z, Gultakti CA, Alangari MN, Wang Y, Demir B, Koker Z, Das AK, Anantram MP, Oren EE, Hihath J.Aminiranjbar Z, et al. Among authors: das ak.ACS Sens. 2024 May 22. doi: 10.1021/acssensors.3c02734. Online ahead of print.ACS Sens. 2024.PMID: 38773960
Wagh L, Singh D, Kumar V, Upadhyay SN, Pakhira S, Das AK.Wagh L, et al. Among authors: das ak.ACS Appl Mater Interfaces. 2024 May 21. doi: 10.1021/acsami.3c18637. Online ahead of print.ACS Appl Mater Interfaces. 2024.PMID: 38771803
CMS Collaboration; Hayrapetyan A, Tumasyan A, Adam W, Andrejkovic JW, Bergauer T, Chatterjee S, Damanakis K, Dragicevic M, Del Valle AE, Hussain PS, Jeitler M, Krammer N, Liko D, Mikulec I, Schieck J, Schöfbeck R, Schwarz D, Sonawane M, Templ S, Waltenberger W, Wulz CE, Darwish MR, Janssen T, Van Mechelen P, Bols ES, D'Hondt J, Dansana S, De Moor A, Delcourt M, El Faham H, Lowette S, Makarenko I, Müller D, Sahasransu AR, Tavernier S, Tytgat M, Van Putte S, Vannerom D, Clerbaux B, De Lentdecker G, Favart L, Hohov D, Jaramillo J, Khalilzadeh A, Lee K, Mahdavikhorrami M, Malara A, Paredes S, Pétré L, Postiau N, Thomas L, Bemden MV, Velde CV, Vanlaer P, De Coen M, Dobur D, Hong Y, Knolle J, Lambrecht L, Mestdach G, Rendón C, Samalan A, Skovpen K, Van Den Bossche N, Wezenbeek L, Benecke A, Bruno G, Caputo C, Delaere C, Donertas IS, Giammanco A, Jaffel K, Jain S, Lemaitre V, Lidrych J, Mastrapasqua P, Mondal K, Tran TT, Wertz S, Alves GA, Coelho E, Hensel C, Menezes De Oliveira T, Moraes A, Rebello Teles P, Soeiro M, Aldá Júnior WL, Alves Gallo Pereira M, Barroso Ferreira Filho M, Brandao Malbouisson H, Carvalho W, Chinellato J, Da Costa EM, Da Silveira GG, De Jesus Damiao D, Fonseca De…See abstract for full author list ➔CMS Collaboration, et al. Among authors: das ak.Eur Phys J C Part Fields. 2024;84(5):493. doi: 10.1140/epjc/s10052-024-12727-4. Epub 2024 May 14.Eur Phys J C Part Fields. 2024.PMID: 38757620Free PMC article.