In this study, the surface of new lapping films was analyzed, and the lapping finishing process was applied to RG7 tin bronze alloy. The research focused on examining lapping films with electrocorundum grains of nominal sizes 30, 12, and 9 μm, commonly used for achieving smooth surfaces. The manufacturing process involves placing abrasive grains and binder onto a polyester tape, resulting in a heterogeneous distribution of abrasive grains. The study investigates the impact of this random distribution on the performance of lapping films during material removal. Scanning electron microscopy was used to analyze the surface structure of abrasive films, revealing distinctive structures formed by the specific aggregation of abrasive grains. This study explores the influence of different nominal grain sizes on surface finish and aims to optimize lapping processes for diverse applications. The research also delves into microchip analysis, examining the products of the lapping film finishing process. Microchips were observed directly on the abrasive tool surface, revealing insights into their morphology and distribution. The chip segmentation frequency was determined, and they amounted to approximately 0.8 to 3 MHz; these are very high frequencies, which are unique for known chip-forming processes.
Keywords: abrasion; chips formation; finishing; generation of microchips; lapping film; morphology of chips; surface finishing.