A mechanistic study identifying improved technology critical metal delamination from printed circuit boards at lower power sonications in a deep eutectic solvent

Ben Jacobson; Shida Li; Rodolfo Marin Rivera; Paul Daly; Christopher E Elgar; Daniel M Mulvihill; Andrew P Abbott; Andrew Feeney; Paul Prentice

doi:10.1016/j.ultsonch.2023.106701

A mechanistic study identifying improved technology critical metal delamination from printed circuit boards at lower power sonications in a deep eutectic solvent

Ultrason Sonochem. 2023 Dec:101:106701. doi: 10.1016/j.ultsonch.2023.106701. Epub 2023 Nov 23.

Authors

Ben Jacobson¹, Shida Li², Rodolfo Marin Rivera³, Paul Daly², Christopher E Elgar³, Daniel M Mulvihill², Andrew P Abbott³, Andrew Feeney², Paul Prentice²

Affiliations

¹ James Watt School of Engineering, University of Glasgow, Glasgow G12 8QQ, UK. Electronic address: Ben.Jacobson@glasgow.ac.uk.
² James Watt School of Engineering, University of Glasgow, Glasgow G12 8QQ, UK.
³ School of Chemistry, University of Leicester, Leicester LE1 7RH, UK.

Abstract

Deep eutectic solvents (DESs) are an emerging class of ionic liquids that offer a solution to reclaiming technology critical metals (TCMs) from electronic waste, with potential for improved life cycle analysis. The high viscosities typical of DESs, however, impose mass transport limitations such that passive TCM removal generally requires immersion over extended durations, in some cases in the order of hours. It is postulated that, through the targeted application of power ultrasound, delamination of key structures in electronic components immersed in DESs can be significantly accelerated, thereby enabling rapid recovery of TCMs. In this paper, we fully characterise cavitation in a Choline Chloride-Ethylene Glycol DES as a function of sonotrode input power, by the acoustic detection of the bubble collapse shockwave content generated during sonications at more than 20 input powers over the available range. This justifies the selection of two powers for a detailed study of ultrasonically enhanced TCM-delamination from printed circuit boards (PCBs). Dual-perspective high-speed imaging is employed, which facilitates simultaneous observation of TCM removal, and the cavitation evolution and interaction with the PCB surface. Bubble jetting is identified as a key contributor to initial pitting of the TCM layers, exposing the larger underlying copper layer, with the contributions of additional inertial cavitation-mediated phenomena such as bubble-collapse shockwaves also demonstrated as important for delamination. Optimal cavitation activity throughout the sonication then promotes etching of the copper base layer of the PCB structure targeted by the DES, liberating the overlaying TCMs in sections as large as 0.79 mm². We report a thirtyfold improvement in processing time compared to passive delamination, with sonications at the lower power outperforming those at the higher power. The results demonstrate the potential for industrially scalable recovery of TCMs from the growing quantities of global e-waste, using combined power ultrasonics and DESs.