Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications

Haibin Tang; Xingzhi Xiao

doi:10.3390/ma16175975

Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications

Materials (Basel). 2023 Aug 31;16(17):5975. doi: 10.3390/ma16175975.

Authors

Haibin Tang¹, Xingzhi Xiao²

Affiliations

¹ School of Intelligent Manufacturing, Nanjing University of Science and Technology, Nanjing 210094, China.
² School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.

Abstract

The current Special Issue entitled "Advances in 3D printed electronics: materials, processes, properties and applications" aims to discuss the latest developments in the field of the AM of structures or components with reinforcements [...].

Publication types

Editorial

Grants and funding

This work was supported by the National Natural Science Foundation of China.