Investigation on Thermal Barrier Coating Damages for Ultrafast Laser Drilling of Cooling Holes

Shaojian Wang; Yue Hu; Yangjie Zuo; Zenan Yang; Ruisong Jiang

doi:10.3390/ma16155395

Investigation on Thermal Barrier Coating Damages for Ultrafast Laser Drilling of Cooling Holes

Materials (Basel). 2023 Jul 31;16(15):5395. doi: 10.3390/ma16155395.

Authors

Shaojian Wang¹, Yue Hu¹, Yangjie Zuo¹, Zenan Yang², Ruisong Jiang¹

Affiliations

¹ School of Aeronautics and Astronautics, Sichuan University, Chengdu 610200, China.
² Science and Technology on Advanced High Temperature Structural Materials Laboratory, Beijing Institute of Aeronautical Materials, Beijing 100095, China.

Abstract

To mitigate the challenges pertaining to coating damage and processing defects arising from the utilization of ultrafast laser drilling for microhole creation in thermal barrier coatings (TBCs), thereby exerting substantial influence on the long-term durability of these microholes, the investigation proposes a comprehensive methodology. It encompasses the design of a two-factor four-level full factorial experiment and the execution of experimental research on picosecond laser drilling of TBC microholes. By meticulously analyzing the morphology of the microholes and the coating interface, the damage mechanisms associated with picosecond laser drilling of TBC microholes, as well as the influence of laser process parameters on coating damage, are revealed. The findings reveal that the optimal microhole entrance quality and the lowest roughness along the hole perimeter are attained at a laser power of 12 W and a scanning speed of 320 mm/s. Moreover, at a laser power of 30 W and a scanning speed of 320 mm/s, the minimal crack length on the blunt angle side of the hole and the highest machining quality are observed.

Keywords: picosecond laser; processing quality; thermal barrier coating microholes.

Grants and funding

This work was funded by the China National Science and Technology Major Project (J2019-VII-0013-0153), the Sichuan Science and Technology Program (No. 2021ZDZX0001, No. 2021ZDZX0002).