Aiming at the shortcomings of the traditional engineering experience in designing thin-film heat flow meters, such as low precision and long iteration time, the finite element analysis model of thin-film heat flow meters is established based on finite element simulation methods, and a double-type thin-film heat flow sensor based on a copper/concentrate thermopile is made. The influence of the position of the thermal resistance layer, heat flux density and thickness of the thermal resistance layer on the temperature gradient of the hot and cold ends of the heat flow sensor were comprehensively analyzed by using a simulation method. When the applied heat flux density is 50 kW/m2 and the thermal resistance layer is located above and below the thermopile, respectively, the temperature difference between the hot junction and the cold junction is basically the same, but comparing the two, the thermal resistance layer located above is more suitable for rapid measurements of heat flux at high temperatures. In addition, the temperature difference between the hot and cold contacts of the thin-film heat flux sensor increases linearly with the thickness of the thermal resistance layer. Finally, we experimentally tested the response-recovery characteristics of the sensors, with a noise of 2.1 μV and a maximum voltage output of 15 μV in a room temperature environment, respectively, with a response time of about 2 s and a recovery time of about 3 s. Therefore, the device we designed has the characteristic of double-sided use, which can greatly expand the scope of use and service life of the device and promote the development of a new type of heat flow meter, which will provide a new method for the measurement of heat flow density in the complex environment on the surface of the aero-engine.
Keywords: finite element simulation; heat flow sensor; thermal resistance layer; thermopile; thin-film type.