Editorial: Advances in bioelectronics and stimulation strategies for next generation neuroprosthetics

Tianruo Guo; Yao-Chuan Chang; Luming Li; Socrates Dokos; Liming Li

doi:10.3389/fnins.2022.1116900

Editorial: Advances in bioelectronics and stimulation strategies for next generation neuroprosthetics

Front Neurosci. 2023 Jan 10:16:1116900. doi: 10.3389/fnins.2022.1116900. eCollection 2022.

Authors

Tianruo Guo¹, Yao-Chuan Chang^{2

3}, Luming Li^{4

5

6}, Socrates Dokos¹, Liming Li⁷

Affiliations

¹ Graduate School of Biomedical Engineering, The University of New South Wales Sydney, Sydney, NSW, Australia.
² Institute of Bioelectronic Medicine, Feinstein Institutes for Medical Research, Manhasset, NY, United States.
³ Medtronic PLC, Minneapolis, MN, United States.
⁴ National Engineering Research Center of Neuromodulation, School of Aerospace Engineering, Tsinghua University, Beijing, China.
⁵ Precision Medicine and Healthcare Research Center, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, China.
⁶ IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, China.
⁷ School of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai, China.

No abstract available

Keywords: neural ultrastructure; neuromodulation; non-invasive stimulation; optimal implantation location; stimulus parameter identification.

Publication types

Editorial

Grants and funding

This work was supported by the National Natural Science Foundation of China (61971280 and 61671300), Tsinghua University Initiative Scientific Research Program (20191080597), University of Toronto-Tsinghua Joint Research Fund (20193080065), Tsinghua Precision Medicine Foundation (LC201906), and the National Key Research and Development Program of China (2021YFC2400200).