Bias-Repeatability Analysis of Vacuum-Packaged 3-Axis MEMS Gyroscope Using Oven-Controlled System

Sensors (Basel). 2022 Dec 26;23(1):256. doi: 10.3390/s23010256.

Abstract

The performance of microelectromechanical system (MEMS) inertial measurement units (IMUs) is susceptible to many environmental factors. Among different factors, temperature is one of the most challenging issues. This report reveals the bias stability analysis of an ovenized MEMS gyroscope. A micro-heater and a control system exploiting PID/PWM were used to compensate for the bias stability variations of a commercial MEMS IMU from BOSCH "BMI 088". A micro-heater made of gold (Au) thin film is integrated with the commercial MEMS IMU chip. A custom-designed micro-machined glass platform thermally isolates the MEMS IMU from the ambient environment and is vacuum sealed in the leadless chip carrier (LCC) package. The BMI 088 built-in temperature sensor is used for temperature sensing of the device and the locally integrated heater. The experimental results reveal that the bias repeatability of the devices has been improved significantly to achieve the target specifications, making the commercial devices suitable for navigation. Furthermore, the effect of vacuum-packaged and non-vacuum-packaged devices was compared. It was found that the bias repeatability of vacuum-packaged devices was improved by more than 60%.

Keywords: MEMS; bias stability; gyroscope; inertial sensors; micro-oven; temperature compensation.

MeSH terms

  • Culture
  • Glass
  • Gold
  • Household Articles*
  • Micro-Electrical-Mechanical Systems*

Substances

  • Gold

Grants and funding

This work is supported by the R&D program of the Korea Evaluation Institute of Industrial Technology (KEIT) assisted in the development of the IMU-embedded, 6-axis and 10-axis compound navigation system, integrating highly reliable inertial measurement unit [IMU], Global Navigation Satellite System [GNSS], magnetometer, and altimeter for manned/unmanned aircraft. This work was (partially) supported by the postdoctoral scholarship program of KoreaTech.