Cu coatings were deposited on acrylonitrile-butadiene-styrene copolymer (ABS) substrates by DC magnetron sputtering with Cu target. Cr ions generated by arc evaporation were used to bombard the ABS substrates before the Cu coating process. The influences of the Cr ion bombardment on the surface topography and chemical bonds of the ABS substrates and the adhesion of the Cu coatings on the ABS substrate were studied using scanning electron microscopy, Fourier transform infrared spectroscopy, and micro-Scratch Tester as a function of bias voltage and treatment duration. The results show that the Cr ion bombardment causes Cr particles to embed in the surface. The Cr particles can interlock with the Cu coatings and ABS substrate and significantly improve the coating adhesion. In addition, the Cr particles can act as the nucleation sites of the Cu coatings and facilitate the growth of columnar crystals. Increasing the duration of Cr ion bombardment increases the number of Cr particles and, thus, enhances the adhesion. However, the continuous bombardment results in the degeneration of the ABS surface, causing the formation of the coarse columnar structure of the Cu coatings. Increasing the bias voltage can increase the energy of the Cr particles without causing degeneration of the ABS. The Cu coating deposited on the ABS substrate treated by Cr ion with high-bias voltage and short duration shows a dense and smooth growth structure. In contrast, the bombardment of the Cr ions carried out at high-bias voltage induces the formation of an interfacial layer (amorphous carbon-rich phase) in the ABS surface, which decreases the coating adhesion. It is believed that Cu coatings with strong adhesion and dense structures could be acquired on ABS substrates by optimizing the bias voltage and duration of the Cr ion bombardment pre-treatment.
Keywords: ABS; adhesion; growth structure; ion bombardment; polymer metallization.