For ultra-scaled technology nodes at channel lengths below 12 nm, two-dimensional (2D) materials are a potential replacement for silicon since even atomically thin 2D semiconductors can maintain sizable mobilities and provide enhanced gate control in a stacked channel nanosheet transistor geometry. While theoretical projections and available experimental prototypes indicate great potential for 2D field effect transistors (FETs), several major challenges must be solved to realize CMOS logic circuits based on 2D materials at the wafer scale. This review discusses the most critical issues and benchmarks against the targets outlined for the 0.7 nm node in the International Roadmap for Devices and Systems scheduled for 2034. These issues are grouped into four areas; device scaling, the formation of low-resistive contacts to 2D semiconductors, gate stack design, and wafer-scale process integration. Here, we summarize recent developments in these areas and identify the most important future research questions which will have to be solved to allow for industrial adaptation of the 2D technology.
Keywords: 2D materials; CMOS logic; Schottky barriers; charge traps; contact resistances; field effect transistors; nanoscale devices; nanosheet FET; process integration; van der Waals interfaces.