Tetrabromobisphenol A (TBBPA) was one of the most widely used brominated flame retardants. However, it easily contaminates nature and harms the environment and human health during its production and use. Therefore, it is necessary to strictly control the content of TBBPA in electronics. Surface-enhanced Raman spectroscopy has the advantages of being fast and sensitive, but it is difficult to obtain the SERS spectra of TBBPA because the hydrophobic TBBPA molecule is difficult to approach with the hydrophilic surface of common noble metal SERS substrates. In the present work, a hydrophobic Cu-Ag chip was developed for the SERS detection of TBBPA. The integration of the hydrophobic interaction and the Ag-Br bonding promoted the adsorption of TBBPA on the Cu-Ag chip, allowing for SERS detection. It was observed that both the hydrophobicity and bimetallic composition of the Cu-Ag chip played important roles in the SERS detection of TBBPA. Under the optimized conditions, the low limit of detection of the established SERS method for TBBPA was 0.01 mg L-1, within a linear range of 0.1-10 mg L-1. Combined with ultrasonic-assisted extraction, the substrate could be used for the quantitative determination of TBBPA in electronic products. Compared with the HPLC-UV method used as a national standard, the relative error of the SERS method for quantifying the TBBPA content in a mouse cable and shell was ±3% and ±7.7%, respectively. According to the SERS results, the recovery of TBBPA in the spiked mouse shell was 95.6%.
Keywords: bi-metal chips; hydrophobic interaction; surface-enhanced Raman scattering; synergistic coupling; tetrabromobisphenol A.