The present study exposes an economical and easy-to-use system to assess the heat transfer in building envelopes by determining the U-value. Nowadays these systems require long wires and a host to collect and process the data. In this work, a multi-point system for simultaneous heat flux measurement has been proposed. The aim is to reduce the long measurement time and the cost of thermal isolation evaluations in large buildings. The system proposed consists of a low-cost 3D-printed heat flux sensor integrated with a LoRa transceiver and two temperature sensors. The heat flux (HF) sensor was compared and calibrated with a commercial HF sensor from the Fluxteq brand.
Keywords: 3D printed; LoRa; U-value; heat flux sensor; low cost; thermal isolation.