Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials

Shanggui Deng; Sharad Bhatnagar; Shan He; Nabeel Ahmad; Abdul Rahaman; Jingrong Gao; Jagriti Narang; Ibrahim Khalifa; Anindya Nag

doi:10.3390/nano12193284

Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials

Nanomaterials (Basel). 2022 Sep 21;12(19):3284. doi: 10.3390/nano12193284.

Authors

Shanggui Deng¹, Sharad Bhatnagar², Shan He^{1

3}, Nabeel Ahmad⁴, Abdul Rahaman⁵, Jingrong Gao⁵, Jagriti Narang⁶, Ibrahim Khalifa⁷, Anindya Nag^{8

9}

Affiliations

¹ Department of Food Science and Pharmaceutics, Zhejiang Ocean University, Zhoushan 316022, China.
² Faculty of Life and Environmental Sciences, University of Tsukuba, 1-1-1, Tennodai, Tsukuba 305-8572, Ibaraki, Japan.
³ Institute for NanoScale Science and Technology, College of Science and Engineering, Flinders University, Bedford Park 5042, Australia.
⁴ Department of Biotechnology, School of Allied Sciences, Dev Bhoomi Uttarakhand University, Naugaon 248007, India.
⁵ School of Food Science and Engineering, South China University of Technology, Guangzhou 510641, China.
⁶ Department of Biotechnology, School of Chemical and Life Sciences, New Delhi 110062, India.
⁷ Food Technology Department, Faculty of Agriculture, Benha University, Moshtohor 13736, Egypt.
⁸ Faculty of Electrical and Computer Engineering, Technische Universität Dresden, 01062 Dresden, Germany.
⁹ Centre for Tactile Internet with Human-in-the-Loop (CeTI), Technische Universität Dresden, 01069 Dresden, Germany.

Abstract

The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore's law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail.

Keywords: capacitors; embedded components; inductors; interconnects; nanomaterials; resistors.

Publication types

Review

Grants and funding

The study was funded by the National Natural Science Foundation of China (32150410363), S&T projects of Guangzhou City (project No.: 202102020731), Guangzhou City University Alliance Fundamental Research Fund (Fund No.: 20210210486), and the S&T projects of China’s Ministry (QN2021163001L). The authors are also thankful for the funding provided by the German Research Foundation (DFG, Deutsche Forschungsgemeinschaft) as part of Germany’s Excellence Strategy—EXC 2050/1—Project ID 390696704—Cluster of Excellence, Centre for Tactile Internet with Human-in-the Loop (CeTI) of Technische University Dresden.