AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Qiaoli Wang; Tianshuo Li; Yafei Ding; Huibao Chen; Xiyue Cao; Jianfei Xia; Baowen Li; Bin Sun

doi:10.1021/acsami.2c12386

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

ACS Appl Mater Interfaces. 2022 Sep 14;14(36):41447-41455. doi: 10.1021/acsami.2c12386. Epub 2022 Sep 1.

Authors

Qiaoli Wang^{1

2}, Tianshuo Li^{1

3}, Yafei Ding⁴, Huibao Chen^{1

2}, Xiyue Cao⁵, Jianfei Xia⁵, Baowen Li^{4

6}, Bin Sun^{1

2

7}

Affiliations

¹ College of Physics, Qingdao University, Qingdao 266071, P. R. China.
² College of Electronics and Information, Qingdao University, Qingdao 266071, P. R. China.
³ Department of Basic, Ma'anshan University, Ma'anshan 243100, P. R. China.
⁴ Department of Material Science and Engineering, Department of Physics, Shenzhen Institute for Quantum Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China.
⁵ College of Chemistry and Chemical Engineering, Shandong Sino-Japanese Center for Collaborative Research of Carbon Nanomaterials, Instrumental Analysis Center of Qingdao University, Qingdao University, Qingdao 266071, P. R. China.
⁶ Paul M. Rady Department of Mechanical Engineering and Department of Physics, University of Colorado, Boulder, Colorado 80305-0427, United States.
⁷ Weihai Innovation Research Institute, Qingdao University, Weihai 264200, P. R. China.

PMID: 36049055
DOI: 10.1021/acsami.2c12386

Abstract

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.

Keywords: air/water interfacial assembly; composites; flexible electronics; thermal conductivity; thermal management.