Comparing three quantification methods on N/Si ratio analysis using electron energy loss spectroscopy (EELS)

Xue Rui; Yun-Yu Wang; Shixin Wang; Sook Fun Chan; Qiang Jin

doi:10.1016/j.micron.2022.103263

Comparing three quantification methods on N/Si ratio analysis using electron energy loss spectroscopy (EELS)

Micron. 2022 Jun:157:103263. doi: 10.1016/j.micron.2022.103263. Epub 2022 Mar 29.

Authors

Xue Rui¹, Yun-Yu Wang², Shixin Wang³, Sook Fun Chan³, Qiang Jin³

Affiliations

¹ Micron Technology Inc., 8000 S Federal Way, Boise, ID 83716, USA. Electronic address: xrui@micron.com.
² Micron Technology Inc., 8000 S Federal Way, Boise, ID 83716, USA. Electronic address: yunyuwang@micron.com.
³ Micron Technology Inc., 8000 S Federal Way, Boise, ID 83716, USA.

PMID: 35390752
DOI: 10.1016/j.micron.2022.103263

Abstract

Precision elemental analysis by EELS at a nano-meter scale is a desirable goal for industrial application, as well as basic scientific research on advanced material analysis. However, sample thickness variation leads to a systematic error in element quantification due to electron plural scattering events and prevents it to be a useful quantitative analytic method. In this paper, we compared three methods to minimize thickness effect: Fourier-log deconvolution, Jump ratio, and Si K-edge by quantifying the N/Si ratio versus different thickness on a standard Si₃N₄ crystal sample. The results indicated that Jump ratio method exceeded other two methods owing to its higher accuracy, short data acquisition time as well as minimum requirement for spectroscopy instrument. The jump ratio method was applied to calculate N/Si ratio in storage nitride layer of 3D NAND trench wafer and blanket wafer, both illustrated that the jump ratio method successfully corrected the thickness effect on EELS composition quantification and largely reduced the relative error compared with the non-corrected result.

Keywords: 3D NAND; EELS; Fourier-log deconvolution; Jump ratio; Quantitative composition analysis; STEM.