In this study, Cu matrix composites reinforced with reduced graphene oxide-coated submicron spherical Cu (SSCu@rGO) exhibiting both high-strength plastic product (UT) and high electrical conductivity (EC) were prepared. SSCu@rGO results in the formation of Cu4O3 and Cu2O nanotransition layers to optimize the interface combination. In addition, as a flow carrier, SSCu@rGO can also render graphene uniformly dispersed. The results show that SSCu@rGO has a significant strengthening effect on the Cu matrix composites. The relative density (RD) of the SSCu@rGO/Cu composites exceeds 95%, and the hardness, UT, and yield strength (YS) reach 106.8 HV, 14,455 MPa% (tensile strength (TS) 245 MPa, elongation (EL) 59%), and 119 MPa; which are 21%, 72%, and 98% higher than those of Cu, respectively. Furthermore, EC is 95% IACS (International Annealed Copper Standard), which is also higher than that of Cu. The strength mechanisms include transfer load strengthening, dislocation strengthening, and grain refinement strengthening. The plastic mechanisms include the coordinated deformation of the interface of the Cu4O3 and Cu2O nanotransition layers and the increase in the fracture energy caused by graphene during the deformation process. The optimized EC is due to SSCu@rGO constructing bridges between the large-size Cu grains, and graphene on the surface provides a fast path for electron motion. This path compensates for the negative influence of grain refinement and the sintering defects on EC. The reduced graphene oxide-reinforced Cu-matrix composites were studied, and it was found that the comprehensive performance of the SSCu@rGO/Cu composites is superior to that of the rGO/Cu composites in all aspects.
Keywords: Cu matrix composites; electrical conductivity; graphene; interface optimization; strength plastic product.