As the electronic interconnection between chips, microbumps are crucial components in advanced packaging for the demand of better performance and higher packaging density. The height and coplanarity of microbumps are critical to ensure the reliability of connections. The poor uniformity in bump height will lead to disconnect or insufficient contact, which will directly result in the failure of the chip's function and a lower yield rate. In this paper, we proposed a height measurement method of microbumps using white-light triangulation combined with geometrical characteristics of bumps. A linear light projection module composed of a lens group and LED light source was set up as well as a high-quality imaging module consisting of a CCD camera and microscope objective group. The projection and imaging model of microbumps illuminated by the light plane at different positions during the scanning process was analyzed. The microbump height is computed from a simple formula based on the geometry of the specimen and the system configuration. The measurement results are compared with that obtained from a commercial optical profiler, and the measurement uncertainty is analyzed in detail.