1 Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
2 Research Institute of Frontier Technology, College of Micro-Nano Electronics, Zhejiang University, Hangzhou, China.
3 Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China. shienzheng@westlake.edu.cn.
4 School of Materials Science and Engineering, Peking University, Beijing, China. shienzheng@westlake.edu.cn.
5 Davidson School of Chemical Engineering, Purdue University, West Lafayette, IN, USA. shienzheng@westlake.edu.cn.
6 Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
7 Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
8 Department of Chemistry, Purdue University, West Lafayette, IN, USA.
9 Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China.
10 College of Chemistry and Molecular Engineering, Peking University, Beijing, China.
11 Department of Chemical and Biological Engineering, Iowa State University, Ames, IA, USA.
12 Key Laboratory for the Physics and Chemistry of Nanodevices and Department of Electronics, Peking University, Beijing, China.
13 Division of Advanced Nano-Materials, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, China.
14 Davidson School of Chemical Engineering, Purdue University, West Lafayette, IN, USA.
15 Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA. tpalacios@mit.edu.
16 School of Materials Science and Engineering, Peking University, Beijing, China. anyuan@pku.edu.cn.
17 Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA. jingkong@mit.edu.