Silicon nano-film is essential for the rapidly developing fields of nanoscience and flexible electronics, due to its compatibility with the CMOS process. Viscoelastic PDMS material can adhere to Si, SiO2, and other materials via intermolecular force and play a key role in flexible electronic devices. Researchers have studied many methods of transfer printing silicon nano-films based on PDMS stamps with pyramid microstructures. However, only large-scale transfer printing processes of silicon nano-films with line widths above 20 μm have been reported, mainly because the distribution of pyramid microstructures proposes a request on the size of silicon nano-films. In this paper, The PDMS base to the curing agent ratio affects the adhesion to silicon and enables the transfer, without the need for secondary alignment photolithography, and a flat stamp has been used during the transfer printing, with no requirement for the attaching pressure and detaching speed. Transfer printing of 20 μm wide structures has been realized, while the success rate is 99.3%. The progress is promising in the development of miniature flexible sensors, especially flexible hydrophone.
Keywords: PDMS; PI; adhesion; bonding; transfer printing.