Heat stress during seed maturation significantly reduced seed size and quality. Polyamines, especially spermidine (Spd), were reported to be closely related to seed development and plant heat tolerance. Stress-associated proteins (SAPs) also played a critical role in plant heat resistance, but the relationship between Spd and SAPs in improving rice tolerance to heat stress during grain filling has not been reported. Our results showed that the external spraying Spd (1.5 mM) significantly increased seed germination rate, germination index, vigor index and 1000-grain weight, significantly increased endogenous Spd, spermine (Spm) content and peroxidase activity; significantly reduced MDA content; and greatly alleviated the impact of heat stress on rice seed quality during grain filling stage as compared with high temperature control. OsSAP5 was the most upregulated expression induced by Spd, and may be mainly involved in the Spd-mediated enhancement of high-temperature resistance during rice seed development. Overexpression of OsSAP5 in Arabidopsis enhanced 1000-grain weight and seed heat resistance. Exogenous Spd alleviated the survival rate and seedling length, reduced MDA content, and upregulated the expression levels of SPDS and SPMS in Atsap4 mutant under high temperature during seed germination. In all, exogenous Spd alleviated the heat damage on seed quality during the grain filling stage and seed germination stage by improving endogenous Spd and Spm. OsSAP5, a key gene induced by Spd, might be involved in the rice heat resistance and seed quality in coordination with Spd and Spm.
Keywords: high-temperature; seed quality; spermidine; stress-associated proteins; thermotolerance.