SiC particulate reinforced aluminum metal matrix composites (SiCp/Al MMCs) are characterized by controllable thermal expansion, high thermal conductivity and lightness. These properties, in fact, define the new promotional material in areas and industries such as the aerospace, automotive and electrocommunication industries. However, the poor weldability of this material becomes its key problem for large-scale applications. Sintering bonding technology was developed to join SiCp/Al MMCs. Cu nanoparticles and liquid Ga were employed as self-fluxing filler metal in air under joining temperatures ranging from 400 °C to 500 °C, with soaking time of 2 h and pressure of 3 MPa. The mechanical properties, microstructure and gas tightness of the joint were investigated. The microstructure analysis demonstrated that the joint was achieved by metallurgical bonding at contact interface, and the sintered layer was composed of polycrystals. The distribution of Ga was quite homogenous in both of sintered layer and joint area. The maximum level of joint shear strength of 56.2 MPa has been obtained at bonding temperature of 450 °C. The specimens sintering bonded in temperature range of 440 °C to 460 °C had qualified gas tightness during the service, which can remain 10-10 Pa·m3/s.
Keywords: Cu nanoparticles; aluminum metal matrix composites; gas tightness; liquid Ga; sintering bonding.