Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu-Sn-TiO2 coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm3 TiO2 with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm3 power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO2 phase in the Cu-Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO2 particles and allows for the deposition of dense Cu-Sn-TiO2 nanocomposites. It is shown that nanocomposite Cu-Sn-TiO2 coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.
Keywords: Antibacterial properties; Cu–Sn–TiO(2); Electrochemical properties; Nanocomposite coating; Ultrasonic-assisted electrodeposition.
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