Analyzing the evolution of technostress: A science mapping approach

Cristian Salazar-Concha; Pilar Ficapal-Cusí; Joan Boada-Grau; Luis J Camacho

doi:10.1016/j.heliyon.2021.e06726

Analyzing the evolution of technostress: A science mapping approach

Heliyon. 2021 Apr 12;7(4):e06726. doi: 10.1016/j.heliyon.2021.e06726. eCollection 2021 Apr.

Authors

Cristian Salazar-Concha¹, Pilar Ficapal-Cusí², Joan Boada-Grau³, Luis J Camacho⁴

Affiliations

¹ Administration Institute, Faculty of Economic and Administrative Sciences, Universidad Austral de Chile, Independencia 631, Valdivia 5110566, Chile.
² Faculty of Economics and Business, Universitat Oberta de Catalunya, Av. Tibidabo, 39-43, 08035, Barcelona, Spain.
³ Faculty of Education Sciences and Psychology, Universitat Rovira i Virgili, Ctra Valls, S/n, 43007, Tarragona, Spain.
⁴ Division of Business, Department of International Business and Marketing, SUNY Empire State College, 500 Seaview Avenue, Staten Island, NY 10305, USA.

Abstract

This paper analyzes the scientific map of technostress and the scientific production on this topic between 1982 and 2017, highlighting its structure, evolution, and trends in this field. A literature review based on bibliometric analysis of 246 records indexed in Scopus database was conducted. These publications were analyzed according to bibliometric indicators and through science maps with SciMAT. Co-occurrence of terms by grouping techniques was implemented. In addition, elaboration of maps of science and performance analysis for periods was executed. The main contribution of this work is to provide the first scientific map of technostress and a detailed understanding of the scientific production that predicts the directions of future research. The bibliometric analyses permit an overview of the growth, extent and distribution of the scientific literature related to the technostress and the study of the scientific production of an institution, country, author or research group.

Keywords: Bibliometric analysis; Bibliometric indicators; SciMat; Science mapping; Technostress.