Porous Alumina Films Fabricated by Reduced Temperature Sulfuric Acid Anodizing: Morphology, Composition and Volumetric Growth

Materials (Basel). 2021 Feb 6;14(4):767. doi: 10.3390/ma14040767.

Abstract

The volumetric growth, composition, and morphology of porous alumina films fabricated by reduced temperature 280 K galvanostatic anodizing of aluminum foil in 0.4, 1.0, and 2.0 M aqueous sulfuric acid with 0.5-10 mA·cm-2 current densities were investigated. It appeared that an increase in the solution concentration from 0.4 to 2 M has no significant effect on the anodizing rate, but leads to an increase in the porous alumina film growth. The volumetric growth coefficient increases from 1.26 to 1.67 with increasing current density from 0.5 to 10 mA·cm-2 and decreases with increasing solution concentration from 0.4 to 2.0 M. In addition, in the anodized samples, metallic aluminum phases are identified, and a tendency towards a decrease in the aluminum content with an increase in solution concentration is observed. Anodizing at 0.5 mA·cm-2 in 2.0 M sulfuric acid leads to formation of a non-typical nanostructured porous alumina film, consisting of ordered hemispheres containing radially diverging pores.

Keywords: Pilling–Bedworth ratio; X-ray diffraction; aluminum foil; anodic aluminum oxide (AAO); current efficiency; dissociation; galvanostatic anodizing; low current density; sulphuric acid.