Fabrication of the Ni-based composite wires for electrochemical detection of copper(Ⅱ) ions

Jiatuo Yu; Xiaomin Zhang; Minggang Zhao; Yu Ding; Zhengming Li; Ye Ma; Hui Li; Hongzhi Cui

doi:10.1016/j.aca.2020.11.028

Fabrication of the Ni-based composite wires for electrochemical detection of copper(Ⅱ) ions

Anal Chim Acta. 2021 Jan 25:1143:45-52. doi: 10.1016/j.aca.2020.11.028. Epub 2020 Nov 24.

Authors

Jiatuo Yu¹, Xiaomin Zhang¹, Minggang Zhao², Yu Ding¹, Zhengming Li¹, Ye Ma¹, Hui Li³, Hongzhi Cui¹

Affiliations

¹ Department of Materials Science and Engineering, Ocean University of China, 266100, Qingdao, PR China.
² Department of Materials Science and Engineering, Ocean University of China, 266100, Qingdao, PR China. Electronic address: zhaomg@ouc.edu.cn.
³ Optoelectronic Materials and Technologies Engineering Laboratory of Shandong, Physics Department, Qingdao University of Science and Technology, Qingdao, 266100, PR China.

PMID: 33384129
DOI: 10.1016/j.aca.2020.11.028

Abstract

Copper ions (Cu²⁺) pollution in the water environment poses a great threat to the health function of life-sustaining metabolic activities. However, the current detection methods need relatively expensive instruments, complex operation procedures and long time, so a facile and direct detection method is desired to be developed. In this work, the Ni-based composite wires with p-n junction (the Ni/NiO/ZnO/Chitosan wire) and Schottky junction (the Ni/NiO/Au/Chitosan wire) were fabricated, and the barrier driven electrochemical sensing mechanism was studied. The direct and facile detection of Cu²⁺ was achieved with a wide linear range (0-6000 nM) and a low LOD (0.81 nM). The excellent stability and recovery in real water samples made the Ni-based composite wires a promising candidate for the practical application. The interfacial barriers of semiconductor can be used as a special sensing factor to develop novel sensors.

Keywords: Copper ions; Electrochemical detection; Heterojunction; Interfacial barrier.