Thermally enhanced polyolefin composites: fundamentals, progress, challenges, and prospects

Abstract

The low thermal conductivity of polymers is a barrier to their use in applications requiring high thermal conductivity such as electronic packaging, heat exchangers, and thermal management devices. Polyolefins represent about 55% of global thermoplastic production, and therefore improving their thermal conductivity is essential for many applications. This review analyzes the advances in enhancing the thermal conductivity of polyolefin composites. First, the mechanisms of thermal transport in polyolefin composites and the key parameters that govern conductive heat transfer through the interface between the matrix and the filler are discussed. Then, the advantage and limitations of the current methods for measuring thermal conductivity are analyzed. Moreover, the progress in predicting the thermal conductivity of polymer composites using modeling and simulation is discussed. Furthermore, polyolefin composites and nanocomposites with different thermally conductive fillers are reviewed and analyzed. Finally, the key challenges and future directions for developing thermally enhanced polyolefin composites are outlined.

Keywords: 103 Composites; 104 Carbon and related materials; 105 Low-Dimension (1D/2D) materials; 106 Metallic materials; 210 Thermoelectronics / Thermal transport / insulators; 212 Surface and interfaces; 302 Crystallization / Heat treatment / Crystal growth; 303 Mechanical / Physical processing; 700 Others; Polyolefin; composite interfaces; polyethylene; polypropylene; thermal conductivity; thermal conductivity measurements; thermal transport mechanisms.