The nature of self-assembled octadecylphosphonic acid (ODPA) layers on copper substrates

Abstract

Hypothesis: The self-assembly of amphiphilic molecules onto solid substrates can result both in the formation of monolayers and multilayers. However, on oxidized and non-oxidized copper (Cu), only monolayer formation was reported for phosphonic acids possessing one phosphate head group. Here, the adsorption of octadecylphosphonic acid (ODPA) on Cu substrates through a self-assembly process was investigated with the initial hypothesis of monolayer formation.

Experiments: The relative amount of ODPA adsorbed on a Cu substrate was determined by infrared reflection/absorption spectroscopy (IRRAS) and by atomic force microscopy (AFM) investigations before and after ODPA deposition. X-ray photoelectron spectroscopy (XPS) with sputtering was used to characterize the nature of the layers.

Findings: The results show that the thickness of the ODPA layer increased with deposition time, and after 1 h a multilayer film with a thickness of some tens of nm was formed. The film was robust and required long-time sonication for removal. The origin of the film robustness was attributed to the release of Cu ions, resulting in the formation of Cu-ODPA complexes with Cu ions in the form of Cu(I). Preadsorbing a monolayer of octadecylthiol (ODT) onto the Cu resulted in no ODPA adsorption, since the release of Cu(I) ions was abolished.

Keywords: Atomic force microscopy; Copper leaching; Infrared reflection/absorption spectroscopy; Octadecylphosphonic acid; Self-assembled monolayers; X-ray photoelectron spectroscopy.